缩略术语
AQSIQ国家质量监督检验检疫总局
CCC 中国强制认证
EEE 电子电气设备
EFUP 环保使用期限
EU 欧盟
EUCTP 欧盟中国贸易项目
FAQ’s 常见问题
GAC 中华人民共和国海关总署
IEC 国际电工委员会
Kitemark 英国标准协会认证方案（自主）
MCV 最高浓度值
MII 中华人民共和国信息产业部
MOC 中华人民共和国商业部
NDRC 国家发展和改革委员会
NWML 国家重量和测量实验室
PRC 中华人民共和国
RoHS 限制（在电子电气产品中）使用有害物质的指令
SAIC 国家工商总局
SEPA 中国国家环境保护总局
WEEE 废电子电气设备指令
| Acronym | Definition | Meaning |
| AAS | Atomic absorption spectroscopy | |
| ABS | Acrylonitrile butadiene styrene | |
| ASO | Ag / Sn / O2 | Silver Tin Oxide |
| AgSnO2 | Ag / Sn / O2 | Silver tin oxide |
| Ag | Silver | Chemical Symbol |
| BGA | Ball Grid Array | |
| Bi | Bismuth | Chemical Symbol |
| CAF | Conductive anodic filament | |
| Cd | Cadmium | Chemical Symbol |
| Cr (VI) | Hexavalent Chromium | Chemical Symbol |
| CRT | Cathode ray tube | |
| CSP | Chip Scale Package | |
| DEFRA | Department of the Environment, Food & Rural Affairs | UK Government environment ministry |
| DTI | Department of Trade & Industry | Key UK government department involved in RoHS compliance promotion |
| EC | European Commission | |
| ED-XRF | Energy dispersive X-Ray fluorescence analysis | |
| EEE | Electrical and electronic equipment | |
| ELV | End of Live Vehicles | EU Directive |
| ESH | Environmental Safety & Health | |
| FR4 | A material used as a substrate for a PCB, made of fibreglass & epoxy | |
| FTIR | Fourier transform infra-red (spectroscopy) | |
| GCMS | Gas chromatography mass spectroscopy | |
| HASL | Hot Air Solder Leveling | |
| Hg | Mercury | Chemical Symbol |
| HPLC | High performance liquid chromatography | |
| IC | Integrated circuit or ion chromatography depending on context | |
| ICP | Inductively coupled plasma spectroscopy | |
| IT | Information Technology | |
| LFS | Lead Free Soldering | |
| m.pt. | Melting point | |
| MCV | Maximum Concentration Value | |
| MLCC | Multilayer ceramic capacitors | |
| MSL | Moisture sensitivity level | |
| NiAu | Nickel / Gold | |
| OEM | Original equipment manufacturer | |
| Pb | Lead | Chemical Symbol |
| PBB | Polybrominated Biphenyls | Flame retardant chemical |
| PBDE | Polybrominated Diphenyl Ether | Flame retardant chemical |
| PCB | Printed Circuit Board | |
| PVC | Poly vinyl chloride | |
| QA | Quality assurance | |
| RoHS | Restriction of the use of certain hazardous substances | EU Directive |
| SAB | Sn / Ag / Bi | Tin Silver Bismuth alloy |
| SABC | Sn / Ag / Bi / Cu | Tin Silver Bismuth Copper alloy |
| SAC | Sn / Ag / Cu | Tin Silver Copper alloy |
| SAC305 | Sn / Ag 3.0% / 0.5% Cu | Alloy mix percentiles |
| SAC385 | Sn / Ag 3.8% / 0.5% Cu | Alloy mix percentiles |
| SAC408 | Sn / Ag 4% / 0.8% Cu | Alloy mix percentiles |
| SEM/EDX | Scanning electron microscope / energy dispersive X-ray analysis | |
| SME | Small and medium sized enterprises | |
| Sn | Tin | Chemical Symbol |
| TAC | Adaption Committee | EU Technical Committee |
| TCE | Thermal coefficient of expansion | |
| TCF | Technical compliance file | |
| Tg | Glass transition temperature | |
| VOC | Volatile Octane Compound | |
| WD-XRF | Wavelength dispersive X-Ray fluorescence analysis | |
| WEEE | Waste electrical and electronic equipment | EU Directive |
